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Centre ramps up sports infrastructure investments in Valley

first_imgNew Delhi, Jun 8 (PTI) The centre has sanctioned Rs 200 crore for development of sports infrastructure in Jammu and Kashmir with a hope to dissuade the strife-torn valleys youth from going “astray”. Jammu and Kashmirs sports minister Imran Raza Ansari today called on union sports minister Vijay Goel to discuss initiatives to boost sports activities in the state. “The sports minister of Jammu and Kashmir Imran Raza Ansari met our officers and discussed many things. The meeting was very fruitful. Now the youth of Jammu and Kashmir will not go astray and will not be attracted towards destructive activities,” Goel said at his official residence. A total of Rs 50 crore has already been released by the government, specifically to upgrade the existing infrastructure in Poonch and Rajouri districts, besides building indoor halls in 12 other districts of the state. To enhance the sports infrastructure further, the ministry of youth affairs and sports has got PSUs to put in Rs 40 crore. Goel added, “We had been working in this direction. There will be better facilitation in the valley as far as sports is concerned, in terms of speeding up of stadiums construction work.” The minister felt it was important that the energy of the youth is channelised towards the betterment of the society and the state. “The youth of Jammu and Kashmir has tremendous potential to excel in the arena of sports and work for nation building and were committed to provide them the best. “The other day in our institute in Patiala we have given a lot of youth from Jammu and Kashmir opportunity to do coaching courses and many among those will be appointed coaches by the government.” Ansari said there is no dearth of talent in Jammu and Kashmir. “I thank Goel saab for all the help, all our demands are being considered. There is a lot of talent in Jammu and Kashmir and they just need good guidance. Sports was in the background in Jammu and Kashmir before Goel saab,” Ansari, who also holds the youth services, technical education and information technology portfolios, said. PTI AH PM PMadvertisementlast_img read more

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DATA MODUL: ultra slim SBCs expand possible applications

first_img Continue Reading Previous Solid Sands: SuperTest helps Peloton enhance ‘big-rig’ safety and fuel efficiencyNext Tackling security vulnerabilities of the industrial IoT DATA MODUL reacts to the constantly increasing demand for faster, more efficient and, at the same time, well-designed boards with their own ultra slim SBC development, the eDM-SBC-iMX6-PPC. In sensitive sectors such as medicine, these SBCs are used particularly frequently, as they are generally more vibration and shock resistant than module-based systems. With the SBC form factor, especially designed for slim PPCs, DATA MODUL is standardizing ARM boards for the first time, as these allow the slim implementation of particularly popular display formats such as 7”, 10.1” 12” and 15.6”. Standard kits, consisting of display, the easyTouch sensor, also developed by DATA MODUL, controller and corresponding cabling, also only require short lead times.DATA MODUL has specialized in mechanical integration and, to achieve an optimum casing construction, design and function aspects with regard to material, dimensions, production possibilities and feasibility must be analyzed. Speakers, cameras, light conductors, semi-transparent surfaces and specific surface roughness of the front frame are challenges when developing a casing concept. The demanding EMC requirements and the heat management systems are taken into account at all times by the DATA MODUL construction department.With its 130 x 80mm dimensions, this format offers 30% more room in width and thus allows more leeway for interfaces than Pico-ITX (100mm). To be able to make use of the maximum installation space behind a 7” LCD, the height was increased to 80 compared to the Pico-ITX of 72 mm. The assembly can reach the extremely low depth of maximum 13 mm by using flat connectors, where the mating connectors are applied at the side. In this way, no installation height is lost through the connection of the interfaces and the network cable bushing (RJ45) remains the highest point of the assembly. To become even flatter, an integrated version was used which finally led to a top level of 8.2 mm from the top edge of the circuit board.Fitted with the NXPi.MX6 ARM Cortex A9 processor family, scalable from 1 to 4 ARM cores, the (long-term) availability of the CPU is guaranteed until 2028. It has a sophisticated high-end 3D-capable HD graphics interface. Single supply DC was implemented as a power supply. A 12VDC +/-5% or a wide range input with 16VDC to 32VDC can be selected via the equipment option. The 2 x 24 Bit LVDS interface allows the connection of LC displays with a resolution of up to 1920×1200 pixels (WUXGA). The backlight supply with PWM dimming is already available.A micro HDMI socket was included as an external graphics interface. The assembly is designed for the extended temperature range and can also be delivered painted if required (conformal coating) to avoid short circuits in humid ambient environments. Up to 2 GB of main memory and up to 64GB of eMMC SDD can be soldered and a WIFI/BT module (M.2 standard) can be optionally fitted. Along with the mPCIE interface for the optional extensions with standard modules, 4 x USB 2.0, 1 x Gigabit ethernet, audio with amplifier, SPI, 2 x CAN /UART and 8 GPIOs have been brought out. The micro SD card socket on the bottom side also enables to expand with cheap mass storage devices for data collection.Share this:TwitterFacebookLinkedInMoreRedditTumblrPinterestWhatsAppSkypePocketTelegram Tags: Boards & Modules last_img read more